Semiconductor manufacturing method

ABSTRACT

A method of manufacturing a semiconductor structure includes receiving a substrate, receiving a heater, receiving an electrode, and receiving a sensing material. The substrate have a first surface, a second surface opposite to the first surface and a plurality of vias extending from the second surface toward the first surface and filled with a conductive or semiconductive material and a first oxide layer, the first oxide layer surrounding the conductive or semiconductive material in the plurality of vias, and a second oxide layer disposed over the first surface and the second surface. The heater is disposed within a membrane over the first surface of the substrate and electrically connected with the substrate. The electrode is over the heater and the membrane; and the sensing material covers a portion of the electrode.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a division of U.S. application Ser. No. 15/416,411,filed on Jan. 26, 2017, which is a continuation of U.S. application Ser.No. 14/844,486, filed on Sep. 3, 2015, and claims priority thereto.

BACKGROUND

Electronic equipment involving semiconductive devices are essential formany modern applications. The semiconductive device has experiencedrapid growth. Technological advances in materials and design haveproduced generations of semiconductive devices where each generation hassmaller and more complex circuits than the previous generation. In thecourse of advancement and innovation, functional density (i.e., thenumber of interconnected devices per chip area) has generally increasedwhile geometric size (i.e., the smallest component that can be createdusing a fabrication process) has decreased. Such advances have increasedthe complexity of processing and manufacturing semiconductive devices.

Micro-electro mechanical system (MEMS) devices have been recentlydeveloped and are also commonly involved in electronic equipment. TheMEMS device is micro-sized device, usually in a range from less than 1micron to several millimeters in size. The MEMS device includesfabrication using semiconductive materials to form mechanical andelectrical features. The MEMS device may include a number of elements(e.g., stationary or movable elements) for achieving electro-mechanicalfunctionality. MEMS devices are widely used in various applications.MEMS applications include motion sensors, pressure sensors, printernozzles, or the like. Other MEMS applications include inertial sensors,such as accelerometers for measuring linear acceleration and gyroscopesfor measuring angular velocity. Moreover, MEMS applications are extendedto optical applications, such as movable mirrors, and radio frequency(RF) applications, such as RF switches or the like.

As technologies evolve, design of the devices becomes more complicatedin view of small dimension as a whole and increase of functionality andamounts of circuitries. The devices involve many complicated steps andincreases complexity of manufacturing. The increase in complexity ofmanufacturing may cause deficiencies such as high yield loss, warpage,low signal to noise ratio (SNR), etc. Therefore, there is a continuousneed to modify structure and manufacturing method of the devices in theelectronic equipment in order to improve the device performance as wellas reduce manufacturing cost and processing time.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a schematic perspective view of a semiconductor structure inaccordance with some embodiments of the present disclosure.

FIG. 2 is a schematic exploded view of a semiconductor structure of FIG.1 in accordance with some embodiments of the present disclosure.

FIG. 3 is a schematic cross-sectional view of a semiconductor structurealong AA′ of FIG. 1 in accordance with some embodiments of the presentdisclosure.

FIG. 4 is a schematic perspective view of a semiconductor structure inaccordance with some embodiments of the present disclosure.

FIG. 5 is a schematic exploded view of a semiconductor structure of FIG.4 in accordance with some embodiments of the present disclosure.

FIG. 6 is a schematic cross-sectional view of a semiconductor structurealong BB′ of FIG. 4 in accordance with some embodiments of the presentdisclosure.

FIG. 7 is a schematic perspective view of a semiconductor structure inaccordance with some embodiments of the present disclosure.

FIG. 8 is a schematic cross-sectional view of a semiconductor structurealong CC′ of FIG. 7 in accordance with some embodiments of the presentdisclosure.

FIG. 9 is a flow diagram of a method of manufacturing a semiconductorstructure in accordance with some embodiments of the present disclosure.

FIG. 9A is a cross-sectional view of a first substrate in accordancewith some embodiments of the present disclosure.

FIG. 9B is a cross-sectional view of a first substrate with a firstmembrane layer in accordance with some embodiments of the presentdisclosure.

FIG. 9C is a cross-sectional view of a first substrate with a heater inaccordance with some embodiments of the present disclosure.

FIG. 9D is a cross-sectional view of a first substrate with a secondmembrane layer in accordance with some embodiments of the presentdisclosure.

FIG. 9E is a cross-sectional view of a first substrate with a sensingelectrode in accordance with some embodiments of the present disclosure.

FIG. 9F is a cross-sectional view of a first substrate with asacrificial oxide in accordance with some embodiments of the presentdisclosure.

FIG. 9G is a cross-sectional view of a first substrate with a reducedthickness in accordance with some embodiments of the present disclosure.

FIG. 9H is a cross-sectional view of a first substrate with a metallicmaterial in accordance with some embodiments of the present disclosure.

FIG. 9I is a cross-sectional view of a first substrate with a cavity inaccordance with some embodiments of the present disclosure.

FIG. 9J is a cross-sectional view of a first substrate and a secondsubstrate in accordance with some embodiments of the present disclosure.

FIG. 9K is a cross-sectional view of a first substrate bonded with asecond substrate in accordance with some embodiments of the presentdisclosure.

FIG. 9L is a cross-sectional view of removal of a sacrificial oxide inaccordance with some embodiments of the present disclosure.

FIG. 9M is a cross-sectional view of a semiconductor structure inaccordance with some embodiments of the present disclosure.

FIG. 10 is a flow diagram of a method of manufacturing a semiconductorstructure in accordance with some embodiments of the present disclosure.

FIG. 10A is a cross-sectional view of a first substrate in accordancewith some embodiments of the present disclosure.

FIG. 10B is a cross-sectional view of a first substrate with a firstmembrane layer in accordance with some embodiments of the presentdisclosure.

FIG. 10C is a cross-sectional view of a first substrate with a heater inaccordance with some embodiments of the present disclosure.

FIG. 10D is a cross-sectional view of a first substrate with a secondmembrane layer in accordance with some embodiments of the presentdisclosure.

FIG. 10E is a cross-sectional view of a first substrate with a sensingelectrode in accordance with some embodiments of the present disclosure.

FIG. 10F is a cross-sectional view of a first substrate with asacrificial oxide in accordance with some embodiments of the presentdisclosure.

FIG. 10G is a cross-sectional view of a first substrate with a reducedthickness in accordance with some embodiments of the present disclosure.

FIG. 10H is a cross-sectional view of a first substrate with a metallicmaterial in accordance with some embodiments of the present disclosure.

FIG. 10I is a cross-sectional view of a first substrate with a cavity inaccordance with some embodiments of the present disclosure.

FIG. 10J is a cross-sectional view of a first substrate and a secondsubstrate in accordance with some embodiments of the present disclosure.

FIG. 10K is a cross-sectional view of a second substrate with an IMDlayer in accordance with some embodiments of the present disclosure.

FIGS. 10L-1 and 10L-2 are cross-sectional views of a second substratewith an isolation layer in accordance with some embodiments of thepresent disclosure.

FIG. 10M is a cross-sectional view of a second substrate with a thirdoxide layer in accordance with some embodiments of the presentdisclosure.

FIG. 10N is a cross-sectional view of a second substrate with aninterconnect structure in accordance with some embodiments of thepresent disclosure.

FIG. 10O is a cross-sectional view of a second substrate with a bondingstructure in accordance with some embodiments of the present disclosure.

FIG. 10P is a cross-sectional view of a metallic material bonded with abonding structure in accordance with some embodiments of the presentdisclosure.

FIG. 10Q is a cross-sectional view of removal of a sacrificial oxide inaccordance with some embodiments of the present disclosure.

FIG. 10R is a cross-sectional view of a semiconductor structure inaccordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

A sensor is an electronic equipment for detecting a present of apredetermined material such as a liquid, a gas or etc. The sensor cansense the present of the predetermined material by various suitablemechanisms such as electrochemical, electromechanical, optical or etc.The sensor can sense the predetermined material and generate anelectrical signal accordingly for further processing. The sensor caninvolve a MEMS device for sensing the present of the predeterminedmaterial by electromechanical mechanism, and a complementary metal oxidesemiconductor (CMOS) device for processing the electrical signalgenerated upon the detection of the present of the predeterminedmaterial. The MEMS device can integrate with the CMOS device by suitableoperations such as wire bonding. Since the sensor involves the MEMSdevice and the CMOS device which are fabricated separately, a geometricsize or a form factor of the sensor is undesirably large.

Furthermore, the sensor is required to be operated under a predeterminedhigh operating temperature (for example, greater than 700° C.). Thesensor includes a heater for providing the predetermined operatingtemperature for sensing the predetermined material. The heater is madeof various materials such as tungsten. However, a heating efficiency ofthe heater made by tungsten is relatively low, and a power consumptionof the heater is undesirably high.

In the present disclosure, a sensor with an improved semiconductorstructure is disclosed. The semiconductor structure includes a MEMSdevice and a CMOS device. The MEMS device and the CMOS device areintegrated by formation of vias and bonding operations. Several vias areformed in a MEMS substrate, and a metallic material is disposed over asurface of the MEMS substrate. The metallic material is configured to bebonded with a bonding structure disposed over the CMOS substrate. Assuch, the MEMS device is integrated with the CMOS device by the metallicmaterial and the bonding structure. Such integration can reduce a formfactor of the semiconductor structure and miniaturize the sensor.Furthermore, a performance of the sensor with the improved semiconductorstructure is enhanced, such as low parasitic capacitance, low noise,high signal to noise ratio (SNR), high sensitivity and reactivity, etc.

In addition, the MEMS device in the semiconductor structure isconfigured to detect a present of a predetermined gas. The MEMS deviceincludes a membrane, a heater, a sensing electrode and a sensingmaterial. The sensing electrode can detect the predetermined gas andgenerate a corresponding electrical signal when the predetermined gas ispresent and reacted with the sensing material. The MEMS device isrequired to operate for detection of the predetermined gas under apredetermined temperature. The heater provides the predeterminedtemperature for the operation of the MEMS device. The heater includestungsten alloy, tungsten silicide (WSi), titanium tungsten (TiW),titanium aluminum nitride (TiAlN), tantalum aluminum (TaAl) or etc. Suchheater has a high resistivity and thus provides a high heatingefficiency during the operation of the MEMS device.

FIG. 1 is a schematic perspective view of a semiconductor structure inaccordance with some embodiments of the present disclosure. Thesemiconductor structure includes a first device 100. The first device100 includes a first substrate 101, an oxide 101 d, a cavity 102, ametallic material 103, a membrane 104, a heater 105, a sensing electrode106 and a sensing material 107. FIG. 2 is a schematic exploded view ofthe first device 100, which illustrates the first substrate 101, themembrane 104 and the sensing material 107. The heater 105 is disposedinside the membrane 104. The sensing electrode 106 is partially coveredby the sensing material 107. FIG. 3 is a schematic cross sectional viewof the first device 100 along AA′ of FIG. 1.

In some embodiments, the first device 100 is configured to sense apresent of a predetermined material such as a gas. In some embodiment,the first device 100 is configured to detect a present of a toxic andhazardous gas such as carbon monoxide, etc. In some embodiments, thefirst device 100 is a part of a sensor. In some embodiments, the firstdevice 100 is a part of a gas sensor or a gas detector. In someembodiments, the first device 100 can generate an electrical signal whenthe predetermined material is present and detected. In some embodiments,the first device 100 is a MEMS device including electro-mechanicalelements. In some embodiments, the first device 100 has a small formfactor. In some embodiments, the first device 100 has a thickness ofabout less than about 100 um. In some embodiments, the first device 100is configured to be disposed over and bonded with another substrate.

In some embodiments, the first device 100 includes the first substrate101. In some embodiments, the first substrate 101 includes silicon,glass, ceramic or other suitable materials. In some embodiments, thefirst substrate 101 is a silicon substrate. In some embodiments, thefirst substrate 101 is a MEMS substrate. In some embodiments, the firstsubstrate 101 includes electrical circuits formed on or in the firstsubstrate 101. In some embodiments, the first substrate 101 includestransistors, capacitors, resistors, diodes, photo-diodes and/or thelike. In some embodiments, the first substrate 101 has a thickness ofabout 20 um to about 500 um.

In some embodiments, the first substrate 101 includes a first surface101 a, a second surface 101 b opposite to the first surface 101 a. Insome embodiments, the first substrate 101 includes several vias 101 cpassing through the first substrate 101. In some embodiments, each via101 c is extended from the first surface 101 a to the second surface 101b. In some embodiments, the vias 101 c are trenches. In someembodiments, there is a portion 101 f of the first substrate 101surrounded by adjacent vias 101 c. The portion 101 f is disposed betweentwo or more of the vias 101 c. In some embodiments, each via 101 c isfilled with a conductive or semiconductive material 101 e. In someembodiments, the conductive or semiconductive material 101 e includespolysilicon. In some embodiments, the conductive or semiconductivematerial 101 e is isolated from the first substrate 101 by the firstoxide layer 101 d-1. In some embodiments, the portion 101 f of the firstsubstrate 101 is surrounded by the first oxide layer 101 d-1 and theconductive or semiconductive material 101 e.

In some embodiments, the first substrate 101 includes a first oxidelayer 101 d-1 disposed within the first substrate 101. In someembodiments, the first oxide layer 101 d-1 is disposed conformal to thevias 101 c. In some embodiments, the first oxide layer 101 d-1 isdisposed over a sidewall of the via 101 c. In some embodiments, thefirst oxide layer 101 d-1 surrounds the conductive or semiconductivematerial 101 e. In some embodiments, the first oxide layer 101 d-1isolates the portion 101 f and the conductive or semiconductive material101 e from a rest of the first substrate 101. In some embodiments, thefirst oxide layer 101 d-1 includes silicon oxide or any other suitablematerials. In some embodiments, the first oxide layer 101 d-1 has athickness of about 0.1 um to about 5 um.

In some embodiments, a second oxide layer 101 d-2 is disposed over thesecond surface 101 b of the first substrate 101 and the vias 101 c. Insome embodiments, the second oxide layer 101 d-2 covers the secondsurface 101 b, a portion of the first oxide layer 101 d-1 and a portionof the conductive or semiconductive material 101 e. In some embodiments,the second oxide layer 101 d-2 has a thickness of about 0.1 um to about5 um. In some embodiments, the second oxide layer 101 d-2 is configuredto promote an adhesion with a structure or material disposed thereon.

In some embodiments, the second oxide layer 101 d-2 includes severalfirst recesses 101 g. In some embodiments, the first recess 101 gexposes a part of the portion 101 f of the first substrate 101. In someembodiments, the portion 101 f of the first substrate 101 is not coveredby the second oxide layer 101 d-2. In some embodiments, the second oxidelayer 101 d-2 is coupled with the first oxide layer 101 d-1 and becomesthe oxide 101 d. In some embodiments, the second oxide layer 101 d-2includes same material as or different material from the first oxidelayer 101 d-1. In some embodiments, the second oxide layer 101 d-2includes silicon oxide or other suitable materials. In some embodiments,the thickness of the second oxide layer 101 d-2 is same or differentfrom the thickness of the first oxide layer 101 d-1.

In some embodiments, the cavity 102 is disposed within the firstsubstrate 101. In some embodiments, the cavity 102 is surrounded by thefirst substrate 101. In some embodiments, the cavity 102 passes throughthe first substrate 101 and the second oxide layer 101 d-2. In someembodiments, the cavity 102 extends through the first surface 101 a andthe second surface 101 b of the first substrate 101. In someembodiments, the second oxide layer 101 d-2 is disposed over the cavity102. The cavity 102 passes through the first substrate 101 but not thesecond oxide layer 101 d-2. In some embodiments, the cavity 102 isdisposed at a central portion of the first substrate 101. In someembodiments, a cross section of the cavity 102 is in a rectangular,quadrilateral, triangular, circular, polygonal or other suitable shapes.

In some embodiments, the metallic material 103 is disposed over thefirst surface 101 a of the first substrate 101. In some embodiments, themetallic material 103 covers the portion 101 f of the first substrate101 or the vias 101 c. In some embodiments, the metallic material 103 iselectrically connected with the portion 101 f of the first substrate 101or the conductive or semiconductive material 101 e. In some embodiments,the metallic material 103 includes copper, aluminum, aluminum copperalloy or other suitable materials. In some embodiments, the metallicmaterial 103 is configured to electrically connect with a circuitryexternal to the first substrate 101. In some embodiments, the metallicmaterial 103 is configured to receive a bonding structure.

In some embodiments, the membrane 104 is disposed over the secondsurface 101 b of the first substrate 101, the second oxide layer 101 d-2and the cavity 102. In some embodiments, the membrane 104 is attachedwith the second oxide layer 101 d-2. In some embodiments, the membrane104 includes several holes through the membrane 104. In someembodiments, the membrane 104 includes silicon, silicon dioxide, siliconnitride, silicon carbide, porous silicon, composite film or othersuitable materials. In some embodiments, the membrane 104 has a lowconductivity to minimize heat loss. The heat provided by the heater 105would not be easily dissipated by the membrane 104. In some embodiments,the membrane 104 is in a rectangular, quadrilateral, triangular,circular, polygonal or any other suitable shapes. In some embodiments,the membrane 104 has a thickness of about 0.1 um to about 10 m.

In some embodiments, the heater 105 is disposed within the membrane 104.In some embodiments, the heater 105 includes single or multiple layers.The layers are disposed over each other. In some embodiments, the heater105 includes tungsten alloy, tungsten silicide (WSi), titanium tungsten(TiW), titanium aluminum nitride (TiAlN), tantalum aluminum (TaAl),chromium (Cr), platinum (Pt), titanium nitride (TiN), molybdenum (Mo),polysilicon, silicon carbide (SiC), tantalum nitride (TaN), tantalumoxide (TaO) or other suitable materials. In some embodiments, the heater105 has a width of about 0.1 um to about 25 um. In some embodiments, amelting point of the heater 105 is about 500° C.-3000° C. In someembodiments, a resistivity of the heater 105 is greater than about6×10⁻⁸ ohm-meter (Ω·m).

In some embodiments, the heater 105 is configured to provide anoperating temperature for sensing a predetermined material by the firstdevice 100. A present of the predetermined material is sensed under theoperating temperature. In some embodiments, the operating temperature isabout 200° C. to about 800° C. In some embodiments, the operatingtemperature is greater than about 500° C. In some embodiments, a portionof the heater 105 is electrically connected to a power source, such thatthe heater 105 can provide the operating temperature when an electriccurrent supplied from the power source passes through the heater 105.

In some embodiments, the heater 105 is laterally extended across themembrane 104. In some embodiments, the heater 105 is extended verticallyalong the membrane 104. In some embodiments, the heater 105 is in azigzag configuration. In some embodiments, the heater 105 is extendedover and across the cavity 102. In some embodiments, the heater 105 iselectrically connected with the first substrate 101. In someembodiments, a portion of the heater 105 is electrically connected withthe portion 101 f of the first substrate 101 through the first recess101 g. In some embodiments, the portion of the heater 105 is extendedfrom the membrane 104 to the portion 101 f of the first substrate 101through the second oxide layer 101 d-2. As such, the portion of theheater 105 is surrounded by the membrane 104, the second oxide layer 101d-2 and the portion 101 f of the first substrate 101.

In some embodiments, the sensing electrode 106 is disposed over themembrane 104 and the heater 105. In some embodiments, the sensingelectrode 106 includes tungsten alloy, titanium tungsten (TiW), titaniumaluminum nitride (TiAlN), tantalum aluminum (TaAl), titanium, titaniumnitride (TiN), tantalum, tantalum nitride (TaN), tantalum oxide (TaO),tantalum silicon nitride (TaSiN), platinum (Pt) or other suitablematerials. In some embodiments, the sensing electrode 106 is configuredto sense a predetermined material such as a gas. When the predeterminedmaterial is present, the sensing electrode 106 would generate andtransmit an electrical signal to the first substrate 101, other externalsubstrate or other device for further processing. In some embodiments,the sensing electrode 106 has a width of about 0.1 um to about 25 um.

In some embodiments, the sensing electrode 106 is extended laterally orvertically over a surface of the membrane 104. In some embodiments, thesensing electrode 106 is laterally extended across the surface of themembrane 104. In some embodiments, the sensing electrode 106 is in acomb structure. In some embodiments, a portion of the sensing electrode106 is coupled with the portion of the heater 105 through a third recess104 b of the membrane 104. The portion of the sensing electrode 106 isextended through the third recess 104 b towards the heater 105.

In some embodiments, the sensing material 107 is disposed over thecavity 102 and contacts with the sensing electrode 106. In someembodiments, the sensing material 107 partially covers the sensingelectrode 106, such that a portion of the sensing electrode 106 isencapsulated by the sensing material 107 while another portion of thesensing electrode 106 is extended out from the sensing material 107. Insome embodiments, the sensing material includes tin dioxide (SnO₂), zineoxide (ZnO), indium oxide (In₂O₃) or other suitable materials.

In some embodiments, the sensing material 107 is configured to detect apredetermined material under the operating temperature. In someembodiment, a resistance of the sensing material 107 would change whenthe predetermined material is present and contacted with the sensingmaterial 107. In some embodiments, the sensing electrode 106 isconfigured to sense a change of resistance of the sensing material 107.The resistance of the sensing material 107 is varied by a chemicalreaction between the sensing material 107 and the predeterminedmaterial. The sensing material 107 would react with the predeterminedmaterial, resulting in a change of the resistance of the sensingmaterial 107. For example, when the predetermined material such ascarbon monoxide is present, the resistance of the sensing material 107would be significantly dropped. The decrease of the resistance wouldinitiate generation of an electrical signal from the sensing electrode106. The electrical signal would transmit to the first substrate 101 orother substrate/device accordingly for further processing, such that thepresent of the predetermined material is detected. In some embodiments,when the predetermined material is present, an electrical signal wouldbe generated and transmitted from the sensing electrode 106 to themetallic material 103 through the portion 101 f of the first substrate101.

FIG. 4 is a schematic perspective view of a semiconductor structure 300in accordance with some embodiments of the present disclosure. Thesemiconductor structure 300 includes a first device 100 and a seconddevice 200. FIG. 5 is a schematic exploded view of the semiconductorstructure 300. FIG. 6 is a schematic cross sectional view of thesemiconductor structure 300 along BB′ of FIG. 4.

In some embodiments, the semiconductor structure 300 is configured forsensing a present of a predetermined material such as a gas. In someembodiments, the semiconductor structure 300 is a part of a sensor. Insome embodiments, the semiconductor structure 300 is included in a gassensor. In some embodiments, the semiconductor structure 300 is amonolithic sensor including the first device 100 integrated with thesecond device 200. In some embodiments, the semiconductor structure 300includes the first device 100 which has similar configuration as thefirst device 100 described above or illustrated in any one of FIGS. 1-3.

In some embodiments, the semiconductor structure 300 includes the seconddevice 200 disposed opposite to the first device 100. In someembodiments, the second device 200 is disposed under the first device100. In some embodiments, the first device 100 is mounted on the seconddevice 200. In some embodiments, the first device 100 is bonded with thesecond device 200, so that the first device 100 is integrated with thesecond device 200. In some embodiments, the second device 200 is a CMOSdevice including CMOS components.

In some embodiments, the second device 200 includes a second substrate201 and a bonding structure 204 disposed over the second substrate 201.In some embodiments, the second substrate 201 includes CMOS componentsand circuitries disposed over or in the second substrate 201. In someembodiments, the second substrate 201 includes silicon or other suitablematerials. In some embodiments, the second substrate 201 is a siliconsubstrate. In some embodiments, the second substrate 201 is a CMOSsubstrate. In some embodiments, the second substrate 201 includes afirst surface 201 a and a second surface 201 b opposite to the firstsurface 201 a. In some embodiments, the first surface 201 a of thesecond substrate 201 is opposite to the first surface 101 a of the firstsubstrate 101. In some embodiments, the second substrate 201 has athickness of about 500 um to about 750 um.

In some embodiments, an intermetallic dielectric (IMD) layer 202 isdisposed over the second substrate 201. In some embodiments, the IMDlayer 202 includes oxide such as silicon oxide or other suitablematerials. In some embodiments, the IMD layer 202 is disposed over thefirst surface 201 a of the second substrate 201. In some embodiments, aconductive structure 203 is disposed within the IMD layer 202. In someembodiments, the conductive structure 203 is electrically connected withthe components or circuitries in the second substrate 201. In someembodiments, the conductive structure 203 includes tungsten, copper,aluminum, etc.

In some embodiments, the bonding structure 204 is disposed over thesecond substrate 201 and the IMD layer 202. In some embodiments, thebonding structure 204 is disposed over and electrically connected withthe conductive structure 203. In some embodiments, the bonding structure204 is configured to receive other conductive structure. In someembodiments, the bonding structure 204 includes germanium or othersuitable materials. In some embodiments, the bonding structure 204 isextended over and across the IMD layer 202 or the first surface 201 a ofthe second substrate 201. In embodiments, the bonding structure 204 is abond pad.

In some embodiments, the bonding structure 204 is electrically connectedand bonded with the metallic material 103 to integrate and electricallyconnect the first device 100 with the second device 200. In someembodiments, the sensing electrode 106 is electrically connected withthe conductive structure 203 or the second substrate 201 by the bondingstructure 204 and the metallic material 103. In some embodiments, whenthe predetermined material is present, an electrical signal generated bya change of a resistance of the sensing material 107 is transmitted fromthe first device 100 to the second device 200 for further processing.

FIG. 7 is a schematic perspective view of a semiconductor structure 400in accordance with some embodiments of the present disclosure. Thesemiconductor structure 400 includes a first device 100 and a seconddevice 200. FIG. 8 is a schematic cross sectional view of thesemiconductor structure 400 along CC′ of FIG. 7.

In some embodiments, the semiconductor structure 400 is configured forsensing a present of a predetermined material such as a gas. In someembodiments, the semiconductor structure 400 is a part of a sensor. Insome embodiments, the semiconductor structure 400 is included in a gassensor. In some embodiments, the semiconductor structure 400 is amonolithic sensor including the first device 100 integrated with thesecond device 200. In some embodiments, the semiconductor structure 400includes the first device 100 which has similar configuration as thefirst device 100 described above or illustrated in any one of FIGS. 1-3.In some embodiments, the second device 200 includes a second substrate201, an IMD layer 202, a conductive structure 203 and a bondingstructure 204, which have similar configuration as described above orillustrated in any one of FIGS. 4-6.

In some embodiments, a dielectric layer 208 is disposed over the IMDlayer 202. In some embodiments, the dielectric layer 208 includes oxideor other suitable dielectric materials. In some embodiments, the seconddevice 200 includes an isolation layer 205 disposed over the CMOSsubstrate 201 and configured to thermally isolate the CMOS substrate 201from the MEMS substrate 101. In some embodiments, the present of theisolation layer 205 increases a distance between the CMOS substrate 201and the MEMS substrate 101 or a distance between the first device 100and the second device 200, such that a heat provided by the heater 105would not affect the CMOS substrate 201 or the second device 200. Insome embodiments, the isolation layer 205 includes silicon or othersuitable materials. In some embodiments, the isolation layer 205 is asilicon substrate or silicon wafer. In some embodiments, the isolationlayer 205 includes dielectric material such as silicon oxide, siliconnitride, etc. In some embodiments, the isolation layer 205 is apassivation. In some embodiments, the isolation layer 205 has athickness of about 30 um to about 300 um.

In some embodiments, the isolation layer 205 includes several fourthrecesses 205 a disposed over the conductive structure 203. In someembodiments, the fourth recesses passes through the isolation layer 205and the dielectric layer 208 to expose a portion of the conductivestructure 203, such that the conductive structure 203 can electricallyconnect with external circuitry or components.

In some embodiments, a third oxide layer 207 is disposed over theisolation layer 205. In some embodiments, the third oxide layer 207 isdisposed conformal to the fourth recesses 205. In some embodiments, thethird oxide layer 207 includes silicon oxide or other suitablematerials. In some embodiments, the third oxide layer 207 has athickness of about 0.1 um to about 5 um.

In some embodiments, an interconnect structure 206 is disposed over theisolation layer 205, the third oxide layer 207 and the conductivestructure 203. In some embodiments, the interconnect structure 206includes conductive material such as aluminum, copper, etc. In someembodiments, the interconnect structure 206 is a redistribution layer(RDL).

In some embodiments, the interconnect structure 206 includes a viaportion 206 a and an elongated portion 206 b. In some embodiments, thevia portion 206 a passes through the isolation layer 205 and contactswith the conductive structure 203 or the IMD layer 202. In someembodiments, the via portion 206 a is extended from the isolation layer205 to the IMD layer 202 and is disposed over the conductive structure203. In some embodiments, the via portion 206 a is electricallyconnected with the conductive structure 203. In some embodiments, thevia portion 206 a is conformal to the third oxide layer 207 disposedwithin the fourth recess 205a. In some embodiments, the third oxidelayer 207 is disposed between the via portion 206 a and the isolationlayer 205.

In some embodiments, the interconnect structure 206 includes anelongated portion 206 b extending over and along the isolation layer205. In some embodiments, the elongated portion 206 b is disposed overthe third oxide layer 207. In some embodiments, the elongated portion206 b is electrically connected with the conductive structure 203through the via portion 206 a.

In some embodiments, the elongated portion 206 b is configured toreceive the bonding structure 204. The bonding structure 204 is disposedover the elongated portion 206 b, so that the interconnect structure 206is electrically connected with the bonding structure 204. In someembodiments, the CMOS substrate 201 and the MEMS substrate 101 areintegrated by bonding the metallic material 103 with the bondingstructure 204 and electrically connecting the CMOS substrate 201 withthe MEMS substrate 101. In some embodiments, the elongated portion 206 bis bonded with the bonding structure 204, and the bonding structure 204is bonded with the metallic material 103. Thus, the first device 100 isbonded and integrated with the second device 200 by the metallicstructure 103, the bonding structure 204 and the elongated portion 206b.

In the present disclosure, a method of manufacturing a semiconductorstructure is also disclosed. In some embodiments, a semiconductorstructure is formed by a method 500. The method 500 includes a number ofoperations and the description and illustration are not deemed as alimitation as the sequence of the operations.

FIG. 9 is an embodiment of a method 500 of manufacturing a semiconductorstructure. The method 500 includes a number of operations (501, 502,503, 504, 505, 506, 507, 508, 509, 510, 511, 512 and 513).

In operation 501, a first substrate 101 is received or provided as shownin FIG. 9A. In some embodiments, the first substrate 101 includessilicon, glass, ceramic or other suitable materials. In someembodiments, the first substrate 101 is a silicon substrate. In someembodiments, the first substrate 101 includes electrical circuits formedon or in the first substrate 101. In some embodiments, the firstsubstrate 101 includes a first surface 101 a and a second surface 101 bopposite to the first surface 101 a. In some embodiments, the firstsurface 101 a is a back side of the first substrate 101, while thesecond surface 101 b is a front side of the first substrate 101.

In some embodiments, the first substrate 101 includes several vias 101 cextending from the second surface 101 b towards the first surface 101 a.In some embodiments, the vias 101 c are formed by photolithography andetching operations. In some embodiments, a first oxide layer 101 d-1 isdisposed conformal to the vias 101 c. In some embodiments, the firstoxide layer 101 d-1 is formed within the vias 101 c by thermal oxidationoperations.

In some embodiments, each via 101 c is filled by a conductive orsemiconductive material 101 e. In some embodiments, the conductive orsemiconductive material 101 e includes polysilicon. The first oxidelayer 101 d-1 is disposed between the first substrate 101 and theconductive or semiconductive material 101 e. In some embodiments, theconductive or semiconductive material 101 e is formed by depositionoperations such as chemical vapor deposition (CVD), low pressure CVD(LPCVD), etc. In some embodiments, the conductive or semiconductivematerial 101 e is polished or planarized by suitable operations such aschemical mechanical planarization (CMP).

In some embodiments, a second oxide layer 101 d-2 is disposed over thefirst surface 101 a or the second surface 101 b of the first substrate101. In some embodiments, the second oxide layer 101 d-2 is disposedover the vias 101 c and contacts with the first oxide layer 101 d-1 andthe conductive or semiconductive material 101 e. In some embodiments,the second oxide layer 101 d-2 is formed by thermal oxidationoperations. In some embodiments, the second oxide layer 101 d-2 is samematerial as or different material from the first oxide layer 101 d-1.

In operation 502, a first membrane layer 104-1 is disposed and patternedover the second oxide layer 101 d-2 as shown in FIG. 9B. In someembodiments, the first membrane layer 104-1 is disposed over the secondoxide layer 101 d-2, and then patterned to form several second recesses104 a. In some embodiments, the first membrane layer 104-1 is alsodisposed over the first surface 101 a of the first substrate 101. Insome embodiments, the first membrane layer 104-1 includes silicon,silicon dioxide, silicon nitride, silicon carbide, porous silicon,composite film or other suitable materials. In some embodiments, thefirst membrane layer 104-1 is disposed by CVD or other suitableoperations.

In some embodiments, the second recesses 104 a are formed by removingsome of the first membrane layer 104-1 disposed between the vias 101 c.In some embodiments, the first membrane layer 104-1 is patterned to formthe second recesses 104 a by photolithography and etching operations. Insome embodiments, some of the second oxide layer 101 d-2 disposed underthe second recesses 104 a are also removed to form several firstrecesses 101 g, and thus the first recesses 101 g are coupled with thesecond recesses 104 a respectively. In some embodiments, the firstrecess 101 g passes through the second oxide layer 101 d-2 and extendsto the second surface 101 b of the first substrate 101.

In operation 503, a heater 105 is disposed and patterned over the firstmembrane layer 104-1 as shown in FIG. 9C. In some embodiments, theheater 105 is disposed over the second oxide layer 101 d-2, and thenpatterned by photolithography and etching operations. In someembodiments, the heater 105 is disposed over the second oxide layer 101d-2 and within the first recesses 101 g and the second recesses 104 a.In some embodiments, the heater 105 is electrically connected with aportion 101 f of the first substrate 101 disposed between the vias 101c. In some embodiments, the heater 105 includes tungsten alloy, tungstensilicide (WSi) titanium tungsten (TiW), titanium aluminum nitride(TiAlN), tantalum aluminum (TaAl), chromium (Cr), platinum (Pt),titanium nitride (TiN), molybdenum (Mo), polysilicon, silicon carbide(SiC), tantalum nitride (TaN), tantalum oxide (TaO) or other suitablematerials.

In operation 504, a second membrane layer 104-2 is disposed andpatterned over the heater 105 and the first membrane layer 104-1 asshown in FIG. 9D. In some embodiments, the second membrane layer 104-2is disposed over the first membrane layer 104-1, and then patterned toform several third recesses 104 b. In some embodiments, the secondmembrane layer 104-2 is also disposed over the first surface 101 a ofthe first substrate 101. In some embodiments, the second membrane layer104-2 includes silicon, silicon dioxide, silicon nitride, siliconcarbide, porous silicon, composite film or other suitable materials. Insome embodiments, the second membrane layer 104-2 includes same materialas or different material from the first membrane layer 104-1. In someembodiments, the second membrane layer 104-2 is disposed by CVD or othersuitable operations. In some embodiments, the first membrane layer 104-1and the second membrane layer 104-2 become a membrane 104. The heater105 is disposed within the membrane 104.

In some embodiments, the third recesses 104 b are formed by removingsome of the second membrane layer 104-2 disposed over the secondrecesses 104 a. In some embodiments, the second membrane layer 104-2 ispatterned to form the third recesses 104 b by photolithography andetching operations. In some embodiments, the third recess 104 b extendstowards the heater 105 disposed within the second recess 104 a.

In operation 505, a sensing electrode 106 is disposed over the secondmembrane layer 104-2 as shown in FIG. 9E. In some embodiments, thesensing electrode 106 is disposed over the second membrane layer 104-2and within the third recesses 104 b. In some embodiments, the sensingelectrode 106 is disposed over the heater 105. In some embodiments, aportion of the sensing electrode 106 is coupled with a portion of theheater 105 through the third recess 104 b. In some embodiments, thesensing electrode 106 is patterned by photolithography and etchingoperations. In some embodiments, the sensing electrode 106 is configuredto sense a predetermined material such as a gas. In some embodiments,the sensing electrode 106 includes tungsten alloy, titanium tungsten(TiW), titanium aluminum nitride (TiAlN), tantalum aluminum (TaAl),titanium, titanium nitride (TiN), tantalum, tantalum nitride (TaN),tantalum oxide (TaO), tantalum silicon nitride (TaSiN), platinum (Pt),or other suitable materials.

In operation 506, a sacrificial oxide 108 is disposed over the sensingelectrode 106 and the second membrane layer 104-2 as shown in FIG. 9F.In some embodiments, the sacrificial oxide 108 covers the sensingelectrode 106 and the second membrane layer 104-2 for protection. Insome embodiments, the sacrificial oxide 108 is deposited by suitableoperations such as CVD. In some embodiments, the sacrificial oxide 108is polished and planarized by suitable operations such as chemicalmechanical planarization (CMP).

In operation 507, some of the first substrate 101 are removed from thefirst surface 101 a to expose the conductive or semiconductive material101 e as shown in FIG. 9G. In some embodiments, some of the firstsubstrate 101, the second oxide layer 101 d-2, the first membrane layer104-1 and the second membrane layer 104-2 disposed over the firstsurface 101 a are removed by suitable operations such as grinding,etching, etc. In some embodiments, the removal of some of the firstsurface 101 a is backside grinding operations. In some embodiments, someof the first substrate 101 are removed by grinding the first surface 101a towards the second surface 101 b. In some embodiments, a thickness ofthe first substrate 101 is reduced by grinding over the first surface101 a, such that a new first surface 101 a′ is formed and the conductiveor semiconductive material 101 e is exposed.

In operation 508, a metallic material 103 is disposed over the new firstsurface 101 a′ and the vias 101 c as shown in FIG. 9H. In someembodiments, the metallic material 103 is disposed and then patterned byphotolithography and etching operations, such that the metallic material103 is formed over the portion 101 f of the first substrate 101 and thevias 101 c. In some embodiments, the metallic material 103 is disposedby electroplating, sputtering or other suitable operations. In someembodiments, the first substrate 101 is flipped before formation of themetallic material 103. In some embodiments, the metallic material 103 isconfigured to electrically connect with a circuitry external to thefirst substrate 101. In some embodiments, the metallic material 103 isconfigured to receive a bonding structure. In some embodiments, themetallic material 103 includes copper, aluminum, aluminum copper alloyor other suitable materials.

In operation 509, a cavity 102 is formed as shown in FIG. 9I. In someembodiments, some of the first substrate 101 are removed to form thecavity 102 by photolithography and etching operations. In someembodiments, some of the first substrate 101 are etched from the newfirst surface 101 a′ through the second surface 101 b to expose thefirst membrane layer 104-1 or the second oxide layer 101 d-2. In someembodiments, some of the first substrate 101 are etched until reachingthe second oxide layer 101 d-2. In some embodiments, some of the firstsubstrate 101 and some of the second oxide layer 101 d-2 are removed toform the cavity 102.

In operation 510, a second substrate 201 is received or provided asshown in FIG. 9J. In some embodiments, the second substrate 201 includesa first surface 201 a and a second surface 201 b opposite to the firstsurface 201 a. In some embodiments, the second substrate 201 includesCMOS components and circuitries disposed over or in the second substrate201. In some embodiments, the second substrate 201 includes silicon orother suitable materials. In some embodiments, the second substrate 201is a silicon substrate. In some embodiments, the second substrate 201includes a bonding structure 204 disposed over the second substrate 201.In some embodiments, the bonding structure 204 is configured to receivethe metallic material 103. In some embodiments, an IMD layer 202 isdisposed over the second substrate 201, and a conductive structure 203is disposed within the IMD layer 202. In some embodiments, theconductive structure 203 is disposed under and is electrically connectedwith the bonding structure 204.

In operation 511, the bonding structure 204 and the metallic material103 are bonded as shown in FIG. 9K. In some embodiments, the firstsubstrate 101 is disposed over the second substrate 201, and then themetallic material 103 is disposed and bonded with the bonding structure204. In some embodiments, the metallic material 103 is bonded with thebonding structure 204 by eutectic bonding operations. In someembodiments, the bonding structure 204 includes germanium, and themetallic material 103 includes aluminum.

In operation 512, the sacrificial oxide 108 is removed as shown in FIG.9L. In some embodiments, the sacrificial oxide 108 is removed to exposethe sensing electrode 106 by etching operations such as wet etching orother suitable operations.

In operation 513, a sensing material 107 is disposed over the sensingelectrode 106 as shown in FIG. 9M. In some embodiments, the sensingmaterial 107 is disposed over the cavity 102 and contacts with thesensing electrode 106. In some embodiments, the sensing material 107partially covers the sensing electrode 106, such that a portion of thesensing electrode 106 is encapsulated by the sensing material 107 whileanother portion of the sensing electrode 106 is extended out from thesensing material 107 and is not covered by the sensing material 107. Insome embodiments, the sensing material includes tin dioxide (SnO₂), zineoxide (ZnO), indium oxide (In₂O₃) or other suitable materials.

In some embodiments, a semiconductor structure 300 including a firstdevice 100 and second device 200 is formed. The semiconductor structure300, the first device 100 and the second device 200 have similarconfiguration as in any one of FIGS. 1-6. In some embodiments, thesensing material 107 is configured to detect a predetermined materialunder the operating temperature. In some embodiment, a resistance of thesensing material 107 would change when the predetermined material ispresent and contacted with the sensing material 107. The resistance ofthe sensing material 107 is varied by a chemical reaction between thesensing material 107 and the predetermined material. The change of theresistance of the sensing material 107 is sensed by the sensingelectrode 106.

FIG.10 is an embodiment of a method 600 of manufacturing a monolithicsensor. The method 600 includes a number of operations (601, 602, 603,604, 605, 606, 607, 608, 609, 610, 611, 612, 613, 614, 615, 616, 617 and618).

In operation 601, a first substrate 101 is received or provided as shownin FIG. 10A. The operation 601 is similar to the operation 501 in FIG.9A. In operation 602, a first membrane layer 104-1 is disposed andpatterned as shown in FIG. 10B. The operation 602 is similar to theoperation 502 in FIG. 9B. In operation 603, a heater 105 is disposed andpatterned as shown in FIG. 10C. The operation 603 is similar to theoperation 503 in FIG. 9C. In operation 604, a second membrane layer104-2 is disposed and patterned as shown in FIG. 10D. The operation 604is similar to the operation 504 in FIG. 9D. In operation 605, a sensingelectrode 106 is disposed as shown in FIG. 10E. The operation 605 issimilar to the operation 505 in FIG. 9E. In operation 606, a sacrificialoxide 108 is disposed and patterned as shown in FIG. 10F. The operation606 is similar to the operation 506 in FIG. 9F. In operation 607, someof the first substrate 101 are removed as shown in FIG. 10G. Theoperation 607 is similar to the operation 507 in FIG. 9G. In operation608, a metallic material 103 is disposed as shown in FIG. 10H. Theoperation 608 is similar to the operation 508 in FIG. 9H. In operation609, a cavity 102 is formed as shown in FIG. 10I. The operation 609 issimilar to the operation 509 in FIG. 9I.

In operation 610, a second substrate 201 is received or provided asshown in FIG. 10J. In some embodiments, the second substrate 201includes a first surface 201 a and a second surface 201 b opposite tothe first surface 201 a. In some embodiments, the second substrate 201includes CMOS components and circuitries disposed over or in the secondsubstrate 201. In some embodiments, the second substrate 201 includessilicon or other suitable materials. In some embodiments, the secondsubstrate 201 is a silicon substrate.

In operation 611, an IMD layer 202 is formed over the second substrate201 as shown in FIG. 10K. In some embodiments, the IMD layer 202includes oxide such as silicon oxide or other suitable materials. Insome embodiments, the IMD layer 202 is disposed over the first surface201 a of the second substrate 201. In some embodiments, an conductivestructure 203 is disposed within the IMD layer 202. In some embodiments,the conductive structure 203 is electrically connected with thecomponents or circuitries in the second substrate 201. In someembodiments, the conductive structure 203 includes tungsten, copper,aluminum, etc. In some embodiments, a dielectric layer 208 is disposedover the IMD layer 202. In some embodiments, the dielectric layer 208includes oxide or other suitable dielectric materials.

In operation 612, an isolation layer 205 is disposed and patterned asshown in FIGS. 10L-1 and 10L-2. In some embodiments, the isolation layer205 is disposed over the second substrate 201. In some embodiments, theisolation layer 205 is attached to the IMD layer 202 by bondingoperations. In some embodiments, the isolation layer 205 is a siliconsubstrate or silicon wafer. In some embodiments, the isolation layer 205is bonded over the second substrate 201 by wafer bonding operations. Insome embodiments, the isolation layer 205 includes dielectric materialsuch as silicon oxide, silicon nitride, etc. In some embodiments, theisolation layer 205 is a passivation. In some embodiments, the isolationlayer 205 is disposed by CVD or other suitable operations. In someembodiments, the dielectric layer 208 is patterned by removing some ofthe dielectric layer 208 disposed over the conductive structure 203. Insome embodiments, the isolation layer 205 is patterned by removing someof the isolation layer 205 disposed over the conductive structure 203.In some embodiments, some of the isolation layer 205 are removed byphotolithography and etching operations. As such, several fourthrecesses 205 a are formed after patterning the isolation layer 205 andthe dielectric layer 208. In some embodiments, some of the isolationlayer 205 are removed so as to reduce a thickness of the isolation layer205. In some embodiments, the thickness of the isolation layer 205 isreduced from about 700 um to about 30 um-300 um after bonding over thesecond substrate 201.

In operation 613, a third oxide layer 207 is disposed as shown in FIG.10M. In some embodiments, the third oxide layer 207 is disposedconformal to the isolation layer 205. In some embodiments, the thirdoxide layer 207 is disposed conformal to the fourth recesses 205 a. Insome embodiments, some of the third oxide layer 207 are disposed overthe conductive structure 203, and then are removed to expose theconductive structure 203 by etching or other suitable operations. Insome embodiments, the third oxide layer 207 includes silicon oxide orother suitable materials. In some embodiments, the third oxide layer 207is disposed by CVD or other suitable operations.

In operation 614, an interconnect structure 206 is formed as shown inFIG. 10N. In some embodiments, the interconnect structure 206 is formedincluding formation of an via portion 206 a and an elongated portion 206b. In some embodiments, the interconnect structure 206 is formed byelectroplating, sputtering or other suitable operations. In someembodiments, the interconnect structure 206 includes conductive materialsuch as aluminum, copper, etc. In some embodiments, the interconnectstructure 206 is a redistribution layer (RDL).

In some embodiments, the via portion 206 a contacts with the IMD layer202. In some embodiments, the via portion 206 a is disposed within thefourth recess 205 a and electrically coupled with the conductivestructure 203. In some embodiments, the elongated portion 206 b isdisposed along the third oxide layer 207. In some embodiments, theelongated portion 206 b is electrically connected with the conductivestructure 203 through the via portion 206 a.

In operation 615, a bonding structure 204 is disposed over the elongatedportion 206 b of the interconnect structure 206 as shown in FIG. 100. Insome embodiments, the elongated portion 206 b is configured to receivethe bonding structure 204. The bonding structure 204 is disposed overthe elongated portion 206 b, so that the interconnect structure 206 iselectrically connected with the bonding structure 204. In someembodiments, the bonding structure 204 is disposed by electroplating,sputtering or other suitable operations. In some embodiments, thebonding structure 204 includes germanium.

In operation 616, the metallic material 103 is bonded with the bondingstructure 204 as shown in FIG. 10P. The operation 616 is similar to theoperation 511 in FIG. 9K. In operation 617, the sacrificial oxide 108 isremoved as shown in FIG. 10Q. The operation 617 is similar to theoperation 512 in FIG. 9L. In operation 618, a sensing material 107 isdisposed as shown in FIG. 10R. The operation 618 is similar to theoperation 513 in FIG. 9M. In some embodiments, a semiconductor structure400 including a first device 100 and second device 200 is formed. Thesemiconductor structure 400, the first device 100 and the second device200 have similar configuration as in any one of FIGS. 7-8.

In the present disclosure, an improved semiconductor structure isdisclosed. The semiconductor structure includes a MEMS device integratedwith a CMOS device by formation of vias and bonding operations. Severalvias are formed in a MEMS substrate, and a metallic material is disposedover a surface of the MEMS substrate. The metallic material isconfigured to be bonded with a bonding structure disposed over the CMOSsubstrate. As such, the MEMS device is integrated with the CMOS deviceby the metallic material and the bonding structure. Such integration canreduce a form factor of the semiconductor structure and enhance aperformance of the semiconductor structure.

In some embodiments, a semiconductor structure includes a substrateincluding a plurality of vias passing through the substrate and filledwith a conductive or semiconductive material, and an oxide layersurrounding the conductive or semiconductive material, the substratedefining a cavity therein; a membrane disposed over the substrate andthe cavity; a heater disposed within the membrane and electricallyconnected with the substrate; and a sensing electrode disposed over themembrane and the heater.

In some embodiments, a portion of the substrate is surrounded by two ormore of the plurality of vias. In some embodiments, the heater isdisposed over the portion of the substrate. In some embodiments, theoxide layer is disposed between the substrate and the membrane. In someembodiments, the heater is extended laterally or vertically along themembrane. In some embodiments, the heater includes tungsten alloy,tungsten silicide (WSi), titanium tungsten (TiW), titanium aluminumnitride (TiAlN), tantalum aluminum (TaAl), chromium (Cr), platinum (Pt),titanium nitride (TiN), molybdenum (Mo), polysilicon, silicon carbide(SiC), tantalum nitride (TaN) or tantalum oxide (TaO). In someembodiments, the conductive or semiconductive material includespolysilicon. In some embodiments, the membrane includes silicon, silicondioxide (SiO₂) or silicon nitride (SiN), silicon carbide (SiC), poroussilicon or composite film. In some embodiments, the sensing electrodeincludes tungsten alloy, titanium tungsten (TiW), titanium aluminumnitride (TiAlN), tantalum aluminum (TaAl), titanium, titanium nitride(TiN), tantalum, tantalum nitride (TaN), tantalum oxide (TaO), platinum(Pt) or tantalum silicon nitride (TaSiN).

In some embodiments, a semiconductor structure includes a MEMS substrateincluding a first surface and a second surface opposite to the firstsurface, the MEMS substrate defining a cavity therein; a metallicmaterial disposed over the first surface; a polysilicon disposed withinthe MEMS substrate; an oxide layer disposed between the polysilicon andthe MEMS substrate; a membrane disposed over the second surface of theMEMS substrate and the cavity; a heater disposed within the membrane andelectrically connected with the MEMS substrate; and a sensing electrodedisposed over the membrane and the heater, and electrically connectedwith the MEMS substrate.

In some embodiments, the polysilicon is extended through the MEMSsubstrate. the polysilicon is isolated from the substrate by the oxidelayer. In some embodiments, the metallic material is disposed over thepolysilicon. In some embodiments, the semiconductor structure furtherincludes a CMOS substrate facing to the first surface of the MEMSsubstrate and electrically connected to the MEMS substrate through themetallic material. In some embodiments, the metallic material includesaluminum or copper.

In some embodiments, a method of manufacturing a semiconductor structureincludes receiving a first substrate including a first surface, a secondsurface opposite to the first surface, a plurality of vias extendingfrom the second surface towards the first surface and filled with aconductive or semiconductive material, a first oxide layer disposedbetween the first substrate and the conductive or semiconductivematerial, and a second oxide layer disposed over the first surface andthe second surface of the first substrate; disposing and patterning afirst membrane layer over the second oxide layer and the second surface;disposing and patterning a heater over the first membrane layer;disposing and patterning a second membrane layer over the heater and thefirst membrane layer; disposing a sensing electrode over the secondmembrane layer; disposing a sacrificial oxide over the sensing electrodeand the second membrane layer; removing some of the first substrate fromthe first surface to expose the conductive or semiconductive material;forming a cavity surrounded by the first substrate; and removing thesacrificial oxide.

In some embodiments, the removing some of the first substrate includesgrinding the first surface towards the second surface. In someembodiments, the method further includes disposing a metallic materialover the first surface and the plurality of vias; disposing a sensingmaterial over the sensing electrode; receiving a second substrateincluding a bonding structure disposed over the second substrate;bonding the metallic material with the bonding structure. In someembodiments, the bonding the metallic material with the bondingstructure includes eutectic bonding operations. In some embodiments, theplurality of vias are formed by photolithography and etching operations,or the conductive or semiconductive material is disposed by CVDoperations, or the first oxide layer and the second oxide layer aredisposed by thermal oxidation operations.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A method of manufacturing a semiconductor structure, comprising:receiving a substrate including a first surface, a second surfaceopposite to the first surface and a plurality of vias extending from thesecond surface toward the first surface and filled with a conductive orsemiconductive material and a first oxide layer, the first oxide layersurrounding the conductive or semiconductive material in the pluralityof vias, and a second oxide layer disposed over the first surface andthe second surface; receiving a heater disposed within a membrane overthe first surface of the substrate and electrically connected with thesubstrate; receiving an electrode over the heater and the membrane; andreceiving a sensing material covering a portion of the electrode.
 2. Themethod of claim 1, after receiving the substrate and before receivingthe heater, further comprising: receiving a first membrane layerdisposed over the second oxide layer.
 3. The method of claim 2, furthercomprising: removing a portion of the first membrane layer and a portionof the second oxide layer to form a plurality of second recesses in thefirst membrane layer and a plurality of first recesses in the secondoxide layer between the vias.
 4. The method of claim 3, wherein thefirst recesses are coupled with the second recesses.
 5. The method ofclaim 3, wherein the heater is disposed over the first membrane layerand within the first and the second recesses.
 6. The method of claim 1,wherein the membrane includes a first membrane layer disposed over thefirst surface of the substrate and a second membrane layer disposed overthe first membrane layer, and receiving the heater disposed within themembrane comprises: disposing the heater over the first surface of thesubstrate, laterally and vertically along the membrane, wherein aportion of the heater is surrounded by the first membrane layer and aportion of the heater is over the first membrane layer; and disposingthe second membrane layer over the first membrane and the heater; andpatterning the second membrane layer to form a plurality of thirdrecesses to expose a portion of the heater.
 7. The method of claim 6,wherein the electrode is disposed in the third recesses and electricallyconnects with the heater.
 8. A method of manufacturing a semiconductorstructure, comprising: receiving a first substrate including a firstsurface, a second surface opposite to the first surface and a pluralityof vias extending from the second surface toward the first surface andfilled with a conductive or semiconductive material; receiving a firstmembrane layer over the second surface; receiving a heater over thefirst membrane layer and electrically connected with a portion of thefirst substrate between two or more adjacent vias; receiving a secondmembrane layer over the heater and the first membrane layer; receivingan electrode over the second membrane layer; and exposing the conductiveor semiconductive material from the first surface of the substrate. 9.The method of claim 8, further comprising: receiving an oxide over thesecond surface of the first substrate; and patterning the oxide to forma plurality of first recesses directly over the portion of the firstsubstrate.
 10. The method of claim 9, wherein the oxide includes a firstoxide layer and a second oxide layer, and forming the oxide comprises:receiving a first oxide layer in the vias to isolate the conductive orsemiconductive material; and receiving a second oxide layer over thesecond surface of the first substrate and between the substrate and thefirst membrane layer.
 11. The method of claim 8, wherein receiving afirst membrane layer comprises: disposing the first membrane layer overthe second surface of the first substrate; and patterning the firstmembrane to form a plurality of second recesses directly over theportion of the first substrate.
 12. The method of claim 8, furthercomprising: receiving a metal covering the portion of the firstsubstrate and the vias from the first surface.
 13. The method of claim12, the metal is formed by an electroplating or sputtering operation.14. The method of claim 8, further comprising: receiving a secondsubstrate over the first surface of the first substrate to electricallyconnect with the portion of the first substrate.
 15. A method ofmanufacturing a semiconductor structure, comprising: receiving a MEMSsubstrate including a first surface, a second surface opposite to thefirst surface, and a plurality of vias filled with a polysilicon and anoxide, the polysilicon isolated from the MEMS substrate by an oxide inthe plurality of vias; receiving a heater within a membrane over thesecond surface and electrically connecting to the MEMS substrate;receiving an electrode over the membrane and the heater for sensing, andelectrically connected with the MEMS substrate; receiving a metal overthe first surface and electrically connected with the MEMS substrate;and forming a cavity in the MEMS substrate from the first surface, thecavity surrounded by the MEMS substrate.
 16. The method of claim 15,further comprising: receiving a device over the first surface of theMEMS substrate.
 17. The method of claim 16, wherein the device includesa CMOS substrate and an intermetallic dielectric (IMD) layer between theCMOS substrate and the MEMS substrate, and the IMD layer includes abonding structure electrically connecting with the MEMS substrate. 18.The method of claim 17, further comprising: bonding the metal with thebonding structure by an eutectic bonding operation.
 19. The method ofclaim 15, before receiving the metal further comprising: receiving asacrificial oxide over the electrode and the membrane; and after formingthe cavity further comprising: removing the sacrificial oxide.
 20. Themethod of claim 15, further comprising: receiving a sensing materialbeing over the cavity and contacting with the electrode.